If you say yes here you get support for National Semiconductor LM90,
LM86, LM89 and LM99, Analog Devices ADM1032 and ADT7461, Maxim
MAX6646, MAX6647, MAX6648, MAX6649, MAX6657, MAX6658, MAX6659,
- MAX6680, MAX6681 and MAX6692, and Winbond/Nuvoton W83L771AWG/ASG
- sensor chips.
+ MAX6680, MAX6681, MAX6692, MAX6695, MAX6696, and Winbond/Nuvoton
+ W83L771W/G/AWG/ASG sensor chips.
This driver can also be built as a module. If so, the module
will be called lm90.
will be called sht15.
config SENSORS_S3C
- tristate "S3C24XX/S3C64XX Inbuilt ADC"
- depends on ARCH_S3C2410
+ tristate "Samsung built-in ADC"
+ depends on S3C_ADC
help
If you say yes here you get support for the on-board ADCs of
- the Samsung S3C24XX or S3C64XX series of SoC
+ the Samsung S3C24XX, S3C64XX and other series of SoC
This driver can also be built as a module. If so, the module
- will be called s3c-hwmo.
+ will be called s3c-hwmon.
config SENSORS_S3C_RAW
bool "Include raw channel attributes in sysfs"
This driver can also be built as a module. If so, the module
will be called w83793.
+config SENSORS_W83795
+ tristate "Winbond/Nuvoton W83795G/ADG"
+ depends on I2C && EXPERIMENTAL
+ help
+ If you say yes here you get support for the Winbond W83795G and
+ W83795ADG hardware monitoring chip.
+
+ This driver can also be built as a module. If so, the module
+ will be called w83795.
+
config SENSORS_W83L785TS
tristate "Winbond W83L785TS-S"
depends on I2C && EXPERIMENTAL