X-Git-Url: https://git.karo-electronics.de/?a=blobdiff_plain;f=Documentation%2Fhwmon%2Fw83627ehf;h=d6e1ae30fa6e61f3da3e523befa708dcfbedb627;hb=4ac08d36aa9c556556c7b150caee263c6d542645;hp=ccc2bcb610686aaf44a0d38c5f67db44e8985e82;hpb=b4b613fd83853f8c688b3de20ab1a42331257975;p=mv-sheeva.git

diff --git a/Documentation/hwmon/w83627ehf b/Documentation/hwmon/w83627ehf
index ccc2bcb6106..d6e1ae30fa6 100644
--- a/Documentation/hwmon/w83627ehf
+++ b/Documentation/hwmon/w83627ehf
@@ -23,8 +23,9 @@ W83627DHG super I/O chips. We will refer to them collectively as Winbond chips.
 
 The chips implement three temperature sensors, five fan rotation
 speed sensors, ten analog voltage sensors (only nine for the 627DHG), one
-VID (6 pins), alarms with beep warnings (control unimplemented), and
-some automatic fan regulation strategies (plus manual fan control mode).
+VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG), alarms with beep
+warnings (control unimplemented), and some automatic fan regulation
+strategies (plus manual fan control mode).
 
 Temperatures are measured in degrees Celsius and measurement resolution is 1
 degC for temp1 and 0.5 degC for temp2 and temp3. An alarm is triggered when