]> git.karo-electronics.de Git - linux-beck.git/commit
Thermal: Update binding logic based on platform data
authorDurgadoss R <durgadoss.r@intel.com>
Tue, 18 Sep 2012 05:34:59 +0000 (11:04 +0530)
committerZhang Rui <rui.zhang@intel.com>
Mon, 5 Nov 2012 06:00:06 +0000 (14:00 +0800)
commit7e8ee1e9d7561fe640ae8df6c28f10a6a3239592
tree62424e9e873cf857727d6ce9803f2dc73647a561
parent5a2c090b3327353a78232182f2c7fcd69a46eff0
Thermal: Update binding logic based on platform data

This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
drivers/thermal/thermal_sys.c