]> git.karo-electronics.de Git - linux-beck.git/commit
thermal: ti-soc-thermal: add DT example for DRA752 chip
authorEduardo Valentin <eduardo.valentin@ti.com>
Wed, 29 May 2013 15:07:46 +0000 (15:07 +0000)
committerZhang Rui <rui.zhang@intel.com>
Thu, 13 Jun 2013 02:16:15 +0000 (10:16 +0800)
commitca0c711463565a8735b24f3b08310287adb6b4c9
tree7b782c019d0b2396c79a304c93b2a8c3b0d7c3ac
parent25870e623476ac210f914d6a0a33bea8baa9eadb
thermal: ti-soc-thermal: add DT example for DRA752 chip

Update documentation by adding an example for DRA752 on DT description.

Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt