]> git.karo-electronics.de Git - linux-beck.git/commitdiff
Thermal: Move thermal_instance to thermal_core.h
authorDurgadoss R <durgadoss.r@intel.com>
Tue, 18 Sep 2012 05:34:53 +0000 (11:04 +0530)
committerZhang Rui <rui.zhang@intel.com>
Mon, 5 Nov 2012 05:56:32 +0000 (13:56 +0800)
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
drivers/thermal/thermal_core.h [new file with mode: 0644]
drivers/thermal/thermal_sys.c

diff --git a/drivers/thermal/thermal_core.h b/drivers/thermal/thermal_core.h
new file mode 100644 (file)
index 0000000..0d3205a
--- /dev/null
@@ -0,0 +1,53 @@
+/*
+ *  thermal_core.h
+ *
+ *  Copyright (C) 2012  Intel Corp
+ *  Author: Durgadoss R <durgadoss.r@intel.com>
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ *  This program is free software; you can redistribute it and/or modify
+ *  it under the terms of the GNU General Public License as published by
+ *  the Free Software Foundation; version 2 of the License.
+ *
+ *  This program is distributed in the hope that it will be useful, but
+ *  WITHOUT ANY WARRANTY; without even the implied warranty of
+ *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the GNU
+ *  General Public License for more details.
+ *
+ *  You should have received a copy of the GNU General Public License along
+ *  with this program; if not, write to the Free Software Foundation, Inc.,
+ *  59 Temple Place, Suite 330, Boston, MA 02111-1307 USA.
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ */
+
+#ifndef __THERMAL_CORE_H__
+#define __THERMAL_CORE_H__
+
+#include <linux/device.h>
+#include <linux/thermal.h>
+
+/* Initial state of a cooling device during binding */
+#define THERMAL_NO_TARGET -1UL
+
+/*
+ * This structure is used to describe the behavior of
+ * a certain cooling device on a certain trip point
+ * in a certain thermal zone
+ */
+struct thermal_instance {
+       int id;
+       char name[THERMAL_NAME_LENGTH];
+       struct thermal_zone_device *tz;
+       struct thermal_cooling_device *cdev;
+       int trip;
+       unsigned long upper;    /* Highest cooling state for this trip point */
+       unsigned long lower;    /* Lowest cooling state for this trip point */
+       unsigned long target;   /* expected cooling state */
+       char attr_name[THERMAL_NAME_LENGTH];
+       struct device_attribute attr;
+       struct list_head tz_node; /* node in tz->thermal_instances */
+       struct list_head cdev_node; /* node in cdev->thermal_instances */
+};
+
+#endif /* __THERMAL_CORE_H__ */
index 9ee42ca4d289754cb99b374a32eb8bdc59371e46..bbc834625f7f9199c26b50e3ab28c78ee78dfd4d 100644 (file)
 #include <net/netlink.h>
 #include <net/genetlink.h>
 
+#include "thermal_core.h"
+
 MODULE_AUTHOR("Zhang Rui");
 MODULE_DESCRIPTION("Generic thermal management sysfs support");
 MODULE_LICENSE("GPL");
 
-#define THERMAL_NO_TARGET -1UL
-/*
- * This structure is used to describe the behavior of
- * a certain cooling device on a certain trip point
- * in a certain thermal zone
- */
-struct thermal_instance {
-       int id;
-       char name[THERMAL_NAME_LENGTH];
-       struct thermal_zone_device *tz;
-       struct thermal_cooling_device *cdev;
-       int trip;
-       unsigned long upper;    /* Highest cooling state for this trip point */
-       unsigned long lower;    /* Lowest cooling state for this trip point */
-       unsigned long target;   /* expected cooling state */
-       char attr_name[THERMAL_NAME_LENGTH];
-       struct device_attribute attr;
-       struct list_head tz_node; /* node in tz->thermal_instances */
-       struct list_head cdev_node; /* node in cdev->thermal_instances */
-};
-
 static DEFINE_IDR(thermal_tz_idr);
 static DEFINE_IDR(thermal_cdev_idr);
 static DEFINE_MUTEX(thermal_idr_lock);