From: Toshiaki Makita Date: Fri, 27 Mar 2015 05:31:14 +0000 (+0900) Subject: bonding: Don't segment multiple tagged packets on bonding device X-Git-Url: https://git.karo-electronics.de/?a=commitdiff_plain;h=4847f04982c360ffb233a10e8ef79a16e8be5c28;p=linux-beck.git bonding: Don't segment multiple tagged packets on bonding device Bonding devices don't need to segment multiple tagged packets since their slaves can segment them. Signed-off-by: Toshiaki Makita Signed-off-by: David S. Miller --- diff --git a/drivers/net/bonding/bond_main.c b/drivers/net/bonding/bond_main.c index c026ce9cd7b6..7b4684ccdb3f 100644 --- a/drivers/net/bonding/bond_main.c +++ b/drivers/net/bonding/bond_main.c @@ -4038,6 +4038,7 @@ static const struct net_device_ops bond_netdev_ops = { .ndo_fix_features = bond_fix_features, .ndo_bridge_setlink = ndo_dflt_netdev_switch_port_bridge_setlink, .ndo_bridge_dellink = ndo_dflt_netdev_switch_port_bridge_dellink, + .ndo_features_check = passthru_features_check, }; static const struct device_type bond_type = {