From: Felipe Balbi <balbi@ti.com>
Date: Wed, 6 Feb 2013 07:24:55 +0000 (+0200)
Subject: usb: musb: make davinci and da8xx glues depend on BROKEN
X-Git-Tag: next-20130320~22^2~167
X-Git-Url: https://git.karo-electronics.de/?a=commitdiff_plain;h=787f5627bec80094db487bfcb401e9744f181aed;p=karo-tx-linux.git

usb: musb: make davinci and da8xx glues depend on BROKEN

those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.

Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.

For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).

Signed-off-by: Felipe Balbi <balbi@ti.com>
---

diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig
index 39864e3184a6..de0fc884b6da 100644
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -34,10 +34,12 @@ choice
 config USB_MUSB_DAVINCI
 	tristate "DaVinci"
 	depends on ARCH_DAVINCI_DMx
+	depends on BROKEN
 
 config USB_MUSB_DA8XX
 	tristate "DA8xx/OMAP-L1x"
 	depends on ARCH_DAVINCI_DA8XX
+	depends on BROKEN
 
 config USB_MUSB_TUSB6010
 	tristate "TUSB6010"