From: Felipe Balbi Date: Wed, 6 Feb 2013 07:24:55 +0000 (+0200) Subject: usb: musb: make davinci and da8xx glues depend on BROKEN X-Git-Url: https://git.karo-electronics.de/?a=commitdiff_plain;h=787f5627bec80094db487bfcb401e9744f181aed;p=linux-beck.git usb: musb: make davinci and da8xx glues depend on BROKEN those two glues are still including headers and no active developement has been going on those glues for quite some time. Apparently, for da8xx glue, only initial commit 3ee076de (usb: musb: introduce DA8xx/OMAP-L1x glue layer) has been tested. All other patches seem to have been compile-tested only. For davinci glue layer, last real commit dates back from 2010, with commit f405387 (USB: MUSB: fix kernel WARNING/oops when unloading module in OTG mode). Signed-off-by: Felipe Balbi --- diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig index 39864e3184a6..de0fc884b6da 100644 --- a/drivers/usb/musb/Kconfig +++ b/drivers/usb/musb/Kconfig @@ -34,10 +34,12 @@ choice config USB_MUSB_DAVINCI tristate "DaVinci" depends on ARCH_DAVINCI_DMx + depends on BROKEN config USB_MUSB_DA8XX tristate "DA8xx/OMAP-L1x" depends on ARCH_DAVINCI_DA8XX + depends on BROKEN config USB_MUSB_TUSB6010 tristate "TUSB6010"